![]() These advantages were expected to provide a solution for dicing silicon wafers in the semiconductor industry. The main advantages of laser cutting over mechanical cutting have been its great flexibility, high speed, small cutting width, and high precision. The laser has been used successfully as a cutting tool for almost 20 years now, primarily in the field of metal processing. A significant benefit is the reduction of chipping and imperfections at the edge of the singulated chips. A novel method for dicing wafers with a laser beam guided by total internal reflection in a water jet is described.
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